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MediaTek Dimensity 1050 review and specs (cores, GHz, nm, gpu Gflops, size)

MediaTek Dimensity 1050 specs

   MediaTek Dimensity 1050 top level SoC designed for installation in mobile devices such as tablets and phones, SoC release year 2022. The CPU produced by a 6 nm process. The processor has a eight cores divided into two blocks. The first block ARM Cortex-A78 is the most powerful with four cores running at 2.5 GHz. The second ARM Cortex-A55 has four cores running at 2.0 GHz. The chipset can work with 64-bit data. Mali-G610 MC3 GPU is working with graphical data.
   Devices that have the Dimensity 1050 can work in 4th generation and 5G networks. Maximum speed of download and send are 4700 MBit/s and 2500 MBit/s with the Sub 6GHz 5G Multi-Mode modem.
   You can understand Dimensity 1050 chip is good or bad by looking at benchmark data and comparisons with other processors.
MediaTek Dimensity 1050 review and specs

MediaTek Dimensity 1050 specifications

General Info
BrandMediaTek
NameDimensity 1050
ModelCortex-A78
Release date2022
CPU configuration4x2.5 GHz ARM Cortex-A78, 4x2.0 GHz ARM Cortex-A55
Instruction set architectureARMv8-A
Frequency2500 MHz
Cores8
Word Size64 bit
Process6 nm
Transistor count5600 million
TechnologiesEnergySmart Screen, MiraVision, MediaTek HyperEngine 3.0 gaming technology, Wi-Fi 6 Smart Power Saving, Heterogeneous Multi-Processing, 44Hz UHFR (ultra-high frame rate)
SecurityNeuroPilot, Tiny Sensor Hub, CorePilot, Imagiq 760, Pump Express, Pump Express Wireless, APU 3.0
Neural Processing UnitMediaTek APU 550 Multi-tasking AI Processor
Power consumption (TDP)9 W
L1 cache32 KB
L2 cache320 KB
L3 cache8 MB
Graphics
GPUMali-G610 MC3
Frequency600 MHz
Cores3
Process6 nm
Memory
TypeLPDDR4x, LPDDR5
Frequency4266 MHz
Max volume16 Gb
Internal typeUFS 3.1/2.1
Memory bandwidth29 GB/s
Memory bus4x 16 Bit
Connectivity
ModemSub 6GHz 5G Multi-Mode
Download speed4700 MBit/s
Upload speed2500 MBit/s
Wi-Fi ranges6 a/b/g/n/ac/ax
LocationBeiDou B1I+ B2a, GPS L1CA+L5, NavIC, QZSS L1CA+ L5, Glonass L1OF, Galileo E1 + E5a
Wi-Fi ver.6
Bluetooth ver.5.2
Cameras
Main camera max resolution108 MPix
Second camera max resolution20 and 20 MPix
Codecs3840 x 2160, max FPS 30. Codec: H.264, H.265/HEVC
TechnologiesMulti-Frame Noise reduction
RAW-domain multi-frame HDR
PDAF
MEMA 3DNR
Zig-Zag HDR
(AI) Facial Detection
AI-AE, AI-Shutter, AI-HDR, Video HDR, AI-AWB, AI-AF, AI-NR HDR, Video Bokeh, AI-FD, Video EIS, Video NR, HDR-ISP (3+2)
Multi Person, AI-Segmentation and Bokeh
Hardware Warping Engine (EIS)
AI Panorama Night Shot
Real-time HDR recording and viewing
Anti-Blooming Engine
Display and Audio
Maximum Display resolution2520 x 1080 pix
Video encodingResolution 4K, 2K, FullHD, max FPS 240. Codec: H.264, H.265/HEVC

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MediaTek Dimensity 1050 SoC Comparisons
• Vs Qualcomm Snapdragon 865
• Vs MediaTek Dimensity 1100
• Vs MediaTek Dimensity 1200
• Vs HiSilicon Kirin 9000L
• Vs Samsung Exynos 2000
• Vs Qualcomm Snapdragon 865 Plus
• Vs Samsung Exynos 2100
• Vs Apple A12X Bionic
• Vs Samsung Exynos 1080
• Vs HiSilicon Kirin 9000E
• Vs Mediatek Dimensity 1200 Max
• Vs MediaTek Kompanio 1300T
• Vs HiSilicon Kirin 9000
• Vs Qualcomm Snapdragon 870 5G
• Vs Qualcomm Snapdragon 780G
• Vs Apple A12Z Bionic
• Vs Qualcomm Snapdragon 7 Gen 1
• Vs MediaTek Dimensity 8000
• Vs MediaTek Dimensity 8100
• Vs Google Tensor
• Vs MediaTek Dimensity 1300
• Vs Qualcomm Snapdragon 888
• Vs Qualcomm Snapdragon 875
• Vs Qualcomm Snapdragon 888 Plus
• Vs Qualcomm Snapdragon 888 Pro
• Vs Qualcomm Snapdragon 895
• Vs Qualcomm Snapdragon 898
• Vs Qualcomm Snapdragon 8 Gen 1
• Vs MediaTek Dimensity 9000
• Vs Qualcomm Snapdragon G3x Gen 1
• Vs Apple A14 Bionic
• Vs Qualcomm Snapdragon 778G+
• Vs Qualcomm Snapdragon 775G
• Vs MediaTek Dimensity 1000L
• Vs Apple A13 Bionic
• Vs Samsung Exynos 990
• Vs Mediatek Dimensity 920
• Vs Qualcomm Snapdragon 778G
• Vs MediaTek Dimensity 1000 Plus
• Vs MediaTek Kompanio 900T
• Vs Qualcomm Snapdragon 8cx Gen 3
• Vs Mediatek Dimensity 900
• Vs HiSilicon Kirin 990 5G
• Vs Qualcomm Snapdragon 860
• Vs HiSilicon Kirin 990E
• Vs MediaTek Dimensity 1000C
• Vs HiSilicon Kirin 985
• Vs Apple A12 Bionic
• Vs MediaTek Dimensity 820
• Vs Mediatek Dimensity 810
• Vs Samsung Exynos 9 9820
• Vs Samsung Exynos 1280
• Vs Qualcomm Snapdragon 695
• Vs Qualcomm Snapdragon 8cx Gen 2
• Vs HiSilicon Kirin 820 5G
• Vs Samsung Exynos 9825
• Vs Qualcomm Snapdragon 8cx
• Vs HiSilicon Kirin 980
• Vs Qualcomm Snapdragon 768G
• Vs HiSilicon KIRIN 820E 5G
• Vs MediaTek Dimensity 930
• Vs Samsung Exynos 2200
• Vs MediaTek Dimensity 8100-Max
• Vs MediaTek Kompanio 800T
• Vs MediaTek Kompanio 1380
• Vs MediaTek Kompanio 820
• Vs MediaTek Kompanio 828
• Vs MediaTek Helio G99
• Vs MediaTek Dimensity 8000-Max
• Vs Qualcomm Snapdragon 6 Gen 1
• Vs Qualcomm Snapdragon 4 Gen 1
• Vs Apple A15 Bionic
• Vs Google Tensor G2
• Vs Apple A16 Bionic
• Vs Qualcomm Snapdragon 8 Gen 2
• Vs MediaTek Dimensity 8100-Ultra
• Vs Apple M2
• Vs MediaTek Dimensity 1080
• Vs MediaTek Dimensity 9200
• Vs Qualcomm Snapdargon 782G
• Vs MediaTek Dimensity 8200
• Vs Qualcomm QCM6490
• Vs Qualcomm QCS8250
• Vs Qualcomm QCS7230
• Vs Qualcomm QCS6490
• Vs Qualcomm Snapdragon 8 Gen 3
• Vs MediaTek Dimensity 7200
• Vs Qualcomm Snapdragon 7+ Gen 2
• Vs MediaTek Dimensity 7050
• Vs MediaTek Dimensity 8020
• Vs MediaTek Dimensity 9300
• Vs MediaTek Dimensity 8050
• Vs MediaTek Dimensity 8300
• Vs MediaTek Dimensity 7020
• Vs MediaTek MT8188J
• Vs Unisoc Tiger T820
• Vs MediaTek Dimensity 6080
• Vs Qualcomm Snapdragon 4 Gen 2
• Vs Qualcomm Snapdragon 685
• Vs Unisoc Tiger T760
• Vs Unisoc T750 Tanggula
• Vs MediaTek Dimensity 7200 Ultra
• Vs Google Tensor G3
• Vs HiSilicon KIRIN 9000S
• Vs MediaTek Dimensity 6100 Plus
• Vs Unisoc Tiger T603
• Vs Qualcomm Snapdragon 7 Gen 3
• Vs HiSilicon Kirin 9000SL
• Vs MediaTek Dimensity 8300-Ultra
• Vs MediaTek Dimensity 6300
• Vs MediaTek Dimensity 7025
• Vs MediaTek Dimensity 7300
• Vs MediaTek Dimensity 7300 Ultra
• Vs Qualcomm Snapdragon 8 Elite

MediaTek Dimensity 1050 review

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