HiSilicon Kirin 810 high-end chip designed for installation in mobile gadgets such as phones and tablets, date of announcement 2019. The chipset manufactured using 7 nm process technology. The chip has a eight cores divided into two blocks. The first block ARM Cortex-A76 is the most powerful with two cores working at 2.27 GHz. The second cluster ARM Cortex-A55 has six cores running at 1.8 GHz. The chip supports 64-bit data. Mali-G52 MP6 GPU is responsible for working with graphics. Gadgets that have the Kirin 810 installed can work in 4th generation networks. Maximum speed of download and send are 1400 MBit/s and 900 MBit/s with the 21 modem. To understand Kirin 810 chip is good or bad by looking at testing data and comparisons with other processors.
HiSilicon Kirin 810 specifications
General Info
Brand
HiSilicon
Name
Kirin 810
Model
Cortex-A76
Release date
2019
CPU configuration
2x2.27 GHz ARM Cortex-A76, 6x1.8 GHz ARM Cortex-A55
Instruction set architecture
ARMv8.2-A
Frequency
2270 MHz
Cores
8
Word Size
64 bit
Process
7 nm
Transistor count
?
Technologies
coprocessor i7, GPU Turbo, Yueyin 2.0, Hi6403, AI Cambrian
Power consumption (TDP)
5 W
L1 cache
256 KB
L2 cache
1 MB
Graphics
GPU
Mali-G52 MP6
Frequency
850 MHz
Cores
6
Process
16 nm
Memory
Type
LPDDR4x
Frequency
1600 MHz
Max volume
8 Gb
Internal type
eMMC 5.1
Memory bus
4x 16 Bit
Connectivity
Modem
21
Download speed
1400 MBit/s
Upload speed
900 MBit/s
LTE Cat
Cat-21 DL/Cat-14 UL
Wi-Fi ranges
a/b/g/n/ac
Location
GPS,Galileo,Glonass,Beidou
Wi-Fi ver.
6
Bluetooth ver.
5
Cameras
Main camera max resolution
48 MPix
Second camera max resolution
24 and 24 MPix
Codecs
4096 x 2160, max FPS 60. Codec: H.264, H.265/HEVC
Display and Audio
Maximum Display resolution
2560 x 1600 pix
Video encoding
Resolution 4K, 2K, FullHD, max FPS 60. Codec: H.264, H.265/HEVC
