Qualcomm Snapdragon 860 specs
Qualcomm Snapdragon 860 top level processor designed for installation in mobile gadgets such as tablets and phones, date of announcement 2019. The SoC manufactured using 7 nm process technology. The SoC has a octa-core configuration divided into three blocks. The first cluster Kryo 485 Prime is the fastest with one core running at 2.96 GHz. The second cluster Kryo 485 Gold has three cores running at 2.42 GHz. The third block Kryo 485 Silver has four cores working at 1.8 GHz. The chipset has support for 64-bit data. Adreno 640 GPU works with graphical data. Devices that have the Snapdragon 860 can work in 4th generation and 5th gen networks. Modem Qualcomm Snapdragon X24 LTE modem allows you to download and send data at a speed 2048 MBit/s and 316 MBit/s. To understand Snapdragon 860 chip is good or bad by looking at benchmark data and comparisons with other processors.Qualcomm Snapdragon 860 specifications General Info Brand Qualcomm Name Snapdragon 860 Model SM8150-AC Release date 2019 CPU configuration 1x2.96 GHz Kryo 485 Prime, 3x2.42 GHz Kryo 485 Gold, 4x1.8 GHz Kryo 485 Silver Instruction set architecture ARMv8.1-A Frequency 2960 MHz Cores 8 Word Size 64 bit Process 7 nm Transistor count ? Technologies Qualcomm Hexagon 690 DSP, Qualcomm All-Ways Aware technology, Qualcomm Quick Charge 4/4+ technology Security Mobile Payments, WiFi-Protect, Qualcomm Content Protection, Secure Boot, Biometric Authentication (Fingerprint,Iris,Voice,Face), Qualcomm Trusted Execution Environment, Key Provisioning Security, Crypto Engine, Secure Token, Qualcomm Mobile Security, Malware Protection, Camera Security, Qualcomm Processor Security Neural Processing Unit Quick Charge AI, Hexagon 690 Processor, Hexagon Vector eXtensions (HVX), Hexagon Scalar Accelerator, Hexagon Tensor Accelerator, Sensing Hub Power consumption (TDP) 10 W L1 cache 512 KB L2 cache 1 MB L3 cache 2 MB
Graphics GPU Adreno 640 Frequency 750 MHz Process 10 nm
Memory Type LPDDR4x (Quad Channel) Frequency 2133 MHz Max volume 16 Gb Internal type UFS 2.1 Memory bandwidth 34.1 GB/s Memory bus 4x 16 Bit
Connectivity Modem Qualcomm Snapdragon X24 LTE modem Download speed 2048 MBit/s Upload speed 316 MBit/s LTE Cat Cat-20 DL/Cat-13 UL Wi-Fi ranges Wi-Fi 6-ready, 802.11a/b/g, 802.11ay, Wi-Fi 6, 802.11ad, 802.11n, 802.11ac Wave 2, Always-on Wi-Fi sensing, Wire-equivalent latency, WPA3 security support (ready), Dual-band simultaneous (DBS) (ready), Target Wake Time (ready), 8x8 sounding (ready), Target Wake Time Location Beidou, SBAS, GLONASS, Galileo, GNSS, NavIC enabled, Dual frequency GNSS, GPS, QZSS Wi-Fi ver. 6 Bluetooth ver. 5.1
Cameras Main camera max resolution 192 MPix Second camera max resolution 22 and 22 MPix Codecs 4096 x 2160, max FPS 60. Codec: H.264/AVC,H.265/HEVC, HDR10+, HLG, HDR10 Technologies Hardware accelerator for computer vision (CV-ISP), Dual 14-bit CV-ISPs, Rec. 2020 color gamut video, Up to 10-bit color depth video capture
Display and Audio Maximum Display resolution 2840 x 2160 pix Video encoding Resolution 4K (Ultra HD), 2K, FullHD, max FPS 60. Codec: H.264/AVC,H.265/HEVC, HDR10+, HLG, HDR10 Audio codecs MP4 CAF AAC AIFF WAV MP3
• Devices lists • Benchmarks • PUBG mobile • Fortnite Mobile • Antutu v10 • 3DMark • GeekBench 6, 5 mobile Qualcomm Snapdragon 860 SoC Comparisons • Vs HiSilicon Kirin 990 5G • Vs Mediatek Dimensity 900 • Vs Qualcomm Snapdragon 8cx Gen 3 • Vs MediaTek Dimensity 1000 Plus • Vs Qualcomm Snapdragon 778G • Vs Samsung Exynos 990 • Vs Apple A13 Bionic • Vs MediaTek Dimensity 1000L • Vs Qualcomm Snapdragon 775G • Vs Apple A14 Bionic • Vs Qualcomm Snapdragon 865 • Vs MediaTek Dimensity 1100 • Vs MediaTek Dimensity 1200 • Vs Samsung Exynos 2000 • Vs Qualcomm Snapdragon 865 Plus • Vs Samsung Exynos 2100 • Vs Apple A12X Bionic • Vs Samsung Exynos 1080 • Vs HiSilicon Kirin 9000E • Vs HiSilicon Kirin 9000 • Vs Qualcomm Snapdragon 870 5G • Vs Qualcomm Snapdragon 780G • Vs Apple A12Z Bionic • Vs Qualcomm Snapdragon 888 • Vs HiSilicon Kirin 990E • Vs MediaTek Dimensity 1000C • Vs HiSilicon Kirin 985 • Vs Apple A12 Bionic • Vs MediaTek Dimensity 820 • Vs Samsung Exynos 9 9820 • Vs Qualcomm Snapdragon 8cx Gen 2 • Vs HiSilicon Kirin 820 5G • Vs Samsung Exynos 9825 • Vs Qualcomm Snapdragon 8cx • Vs HiSilicon Kirin 980 • Vs Qualcomm Snapdragon 768G • Vs HiSilicon KIRIN 820E 5G • Vs MediaTek Dimensity 800 • Vs Qualcomm Snapdragon 690 5G • Vs Qualcomm Snapdragon 855 Plus • Vs MediaTek Dimensity 800U • Vs Qualcomm Snapdragon 750G • Vs MediaTek Dimensity 720 5G • Vs MediaTek Helio G95 • Vs Qualcomm Snapdragon 765G • Vs Qualcomm Snapdragon 8c • Vs Qualcomm Snapdragon 855 • Vs Qualcomm Snapdragon 732G • Vs MediaTek Helio G90 • Vs MediaTek Dimensity 700 • Vs Qualcomm Snapdragon 845 SDM845 • Vs MediaTek Helio G90T • Vs Qualcomm Snapdragon 480 5G • Vs Unisoc T760 Tanggula • Vs Unisoc T770 Tanggula • Vs Mediatek Dimensity 810 • Vs Qualcomm Snapdragon 895 • Vs Qualcomm Snapdragon 695 • Vs Qualcomm Snapdragon 480 Plus • Vs Mediatek Dimensity 1200 Max • Vs MediaTek Kompanio 900T • Vs MediaTek Dimensity 8100 • Vs MediaTek Dimensity 8000 • Vs MediaTek Kompanio 1300T • Vs Samsung Exynos 1280 • Vs HiSilicon Kirin 9000L • Vs Qualcomm Snapdragon 7 Gen 1 • Vs Qualcomm Snapdragon 778G+ • Vs MediaTek Dimensity 1050 • Vs MediaTek Dimensity 930 • Vs MediaTek Kompanio 800T • Vs MediaTek Kompanio 1380 • Vs MediaTek Kompanio 820 • Vs MediaTek Kompanio 828 • Vs MediaTek Helio G99 • Vs Qualcomm Snapdragon 4 Gen 1 • Vs Apple A15 Bionic • Vs Qualcomm Snapdragon 6 Gen 1 • Vs MediaTek Dimensity 8000-Max • Vs MediaTek Dimensity 8100-Ultra • Vs MediaTek Dimensity 1080 • Vs MediaTek Dimensity 9200 • Vs Qualcomm Snapdargon 782G • Vs MediaTek Dimensity 8200 • Vs Qualcomm QCM6490 • Vs Qualcomm QCS8250 • Vs Qualcomm QCS7230 • Vs Qualcomm QCS6490 • Vs Qualcomm Snapdragon 7c • Vs Qualcomm Snapdragon 850 • Vs Apple A17 Bionic • Vs Qualcomm Snapdragon 7+ Gen 2 • Vs Rockchip RK3562 Qualcomm Snapdragon 860 review VIDEO