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Qualcomm Snapdragon 898 review and specs (cores, GHz, size, gpu Gflops, nm)

Qualcomm Snapdragon 898 specs

   Qualcomm Snapdragon 898 is a top level processor designed for mobile gadgets such as tablets and smartphones, date of announcement 2021. The processor produced by a 4 nm process. The processor has a octa-core configuration divided into four clusters. The first Cortex-X2 is the most powerful with one core running at 3.09 GHz. The second cluster Cortex-A710 has three cores running at 2.8 GHz. The third and fourth clusters have two cores each operating at frequencies of 2.2 GHz and 1.8 GHz. The processor supports 64-bit data. Adreno 730 GPU is responsible for working with graphical data.
   Gadgets that have the Qualcomm Snapdragon 898 installed can work in 4G and 5G networks. Modem Qualcomm Snapdragon X65 Modem-RF System 5G allows you to download and send data at a speed 15000 MBit/s and 6000 MBit/s.
   You can find out whether Qualcomm Snapdragon 898 chip is good or bad from testing results and comparisons with other processors.
Qualcomm Snapdragon 898 review and specs

Qualcomm Snapdragon 898 specifications

General Info
BrandQualcomm
NameSnapdragon 898
ModelSM8450
Release date2021
CPU configuration1x3.09 GHz Cortex-X2, 3x2.8 GHz Cortex-A710, 2x2.2 GHz Cortex-A510, 2x1.8 GHz Cortex-A510
Instruction set architectureARMv8.2-A
Frequency3090 MHz
Cores8
Word Size64 bit
Process4 nm
Transistor count?
TechnologiesQualcomm aptX Adaptive Audio, Qualcomm TrueWireless Technology, Wi-Fi/Bluetooth Subsystem: Qualcomm FastConnect 6900/7100, Qualcomm TrueWireless Technology, Qualcomm aptX Voice, LE Audio Features (broadcast audio), Bluetooth 5.2, Qualcomm aptX Adaptive Audio, Bluetooth 5.2, Dual Bluetooth Antennas,  LE Audio Features
SecurityQualcomm Processor Security, Mobile Payments, Qualcomm Content Protection, Secure Token, Voice, Malware Protection, Iris, Secure Boot, Key Provisioning Security, Secure Processing Unit (SPU260): Biometric Authentication (Fingerprint, Qualcomm Mobile Security, WiFi-Protect, Camera Security, Qualcomm 3D Sonic Max, Face), Crypto Engine, Qualcomm Trusted Execution Environment, Fingerprint Sensor: Qualcomm 3D Sonic
Neural Processing UnitHexagon 790 Processor
3rd gen Sensing Hub, Large shared AI memory, Hexagon Voice Assistant Accelerator, Hexagon Scalar Accelerator, Hexagon Vector eXtensions (HVX), Hexagon Tensor Accelerator
Power consumption (TDP)6 W
L1 cache1 MB
L2 cache2 MB
L3 cache8 MB
Graphics
GPUAdreno 730
Frequency970 MHz
Process4 nm
Memory
TypeLPDDR5 (Quad Channel)
Frequency3200 MHz
Max volume32 Gb
Internal typeUFS 3.2
Memory bandwidth88 GB/s
Memory bus8x 16 Bit
Connectivity
ModemQualcomm Snapdragon X65 Modem-RF System 5G
Download speed15000 MBit/s
Upload speed6000 MBit/s
LTE CatCat-23 DL/Cat-19 UL
Wi-Fi rangesWi-Fi 6E, Wi-Fi 6, Wi-Fi 5, 802.11a/b/g, 802.11n, MU-MIMO (Uplink and Downlink), 8x8 sounding, 160 M
LocationNavIC enabled, GLONASS, Galileo, GPS, SBAS, GNSS, Dual frequency GNSS, Beidou, NavIC, QZSS
Wi-Fi ver.6
Bluetooth ver.5
Cameras
Main camera max resolution320 MPix
Second camera max resolution128 and 128 MPix
Codecs7680 x 4320, max FPS 120. Codec: Dolby Vision, H.264/AVC,H.265/HEVC, HDR10+, HLG, HDR10
TechnologiesSlow Motion Video Capture: 720p @ 960 FPS, Hardware accelerator for computer vision (CV-ISP), Triple 14-bit CV-ISPs, Real-time object classification, Multi-frame Noise Reduction (MFNR), Qualcomm Spectra 580 image signal processor, Low light photography architecture, 10-bit HDR HEIF photo capture
Display and Audio
Maximum Display resolution7680 x 4320 pix
Video encodingResolution 8K, 4K (Ultra HD), 2K, FullHD, max FPS 120. Codec: Dolby Vision, H.264/AVC,H.265/HEVC, HDR10+, HLG, HDR10

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Qualcomm Snapdragon 898 SoC Comparisons
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• Vs HiSilicon Kirin 990E
• Vs MediaTek Dimensity 1000C
• Vs HiSilicon Kirin 985
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• Vs Mediatek Dimensity 1200 Max
• Vs MediaTek Dimensity 8100
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• Vs MediaTek Kompanio 1300T
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• Vs HiSilicon Kirin 9000L
• Vs Qualcomm Snapdragon 7 Gen 1
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• Vs MediaTek Dimensity 1050
• Vs Samsung Exynos 2200
• Vs Qualcomm Snapdragon 8 Plus Gen 1
• Vs MediaTek Dimensity 9000 Plus
• Vs MediaTek Dimensity 8100-Max
• Vs MediaTek Kompanio 1380
• Vs MediaTek Dimensity 8000-Max
• Vs Qualcomm Snapdragon 8 Gen 2
• Vs Qualcomm Snapdragon 6 Gen 1
• Vs Apple A16 Bionic
• Vs Apple A15 Bionic
• Vs Google Tensor G2
• Vs MediaTek Dimensity 8100-Ultra
• Vs Apple M2
• Vs Qualcomm Snapdragon 8cx Gen 3
• Vs MediaTek Dimensity 1080
• Vs MediaTek Dimensity 9200
• Vs Qualcomm Snapdargon 782G
• Vs MediaTek Dimensity 8200
• Vs Qualcomm QCM6490
• Vs Qualcomm QCS8250
• Vs Qualcomm QCS7230
• Vs Qualcomm QCS6490
• Vs Qualcomm Snapdragon 8 Gen 3
• Vs Samsung Exynos 1330
• Vs Samsung Exynos 1380
• Vs Apple A17 Bionic
• Vs MediaTek Dimensity 6020
• Vs MediaTek Dimensity 7200
• Vs Qualcomm Snapdragon 7+ Gen 2
• Vs MediaTek Dimensity 8020
• Vs MediaTek Dimensity 9300
• Vs MediaTek Dimensity 8050
• Vs MediaTek Dimensity 9200 Plus
• Vs MediaTek MT8188J
• Vs Unisoc Tiger T820
• Vs MediaTek Dimensity 6080
• Vs Qualcomm Snapdragon 4 Gen 2
• Vs Google Tensor G3
• Vs HiSilicon KIRIN 9000S
• Vs MediaTek Dimensity 6100 Plus
• Vs MediaTek Dimensity 7030
• Vs Qualcomm Snapdragon 7s Gen 2
• Vs Qualcomm Snapdragon 7 Gen 3
• Vs HiSilicon Kirin 9000SL
• Vs HiSilicon Kirin 8000
• Vs MediaTek Dimensity 8300-Ultra

Qualcomm Snapdragon 898 review

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